Research-grade epitaxial wafers


Gallium Arsenide (GaAs)-Based High-Efficiency Solar Cells

2024.12.10 | EPI Solution


Our GaAs-based photovoltaic (PV) epi wafers are meticulously engineered for high-efficiency solar energy conversion, tailored for aerospace, portable power, and flexible electronics applications. Grown by advanced epitaxial techniques, these wafers deliver exceptional crystallinity, ultra-thin flexibility, and high power-to-weight ratios—enabling next-generation lightweight PV modules.


Innovative Epitaxial Design for High-Efficiency GaAs Solar Cells

Our solar structures adopt a dual-junction or ultra-thin single-junction configuration, designed for maximum photon absorption and minimal recombination losses. The epitaxial layers are precisely thickness-controlled, ensuring optimal quantum efficiency and current matching across junctions. Integration with lift-off and direct bonding techniques allows flexible or multi-surface deployment.

Advanced Expertise in GaAs PV Growth and Processing

EpiSolution’s team brings extensive experience in the growth, lift-off, and transfer of high-performance GaAs-based solar structures. We support customers from initial structure design through to scalable fabrication, leveraging adhesive-free metal bonding and wafer recycling to enhance efficiency and sustainability. Whether for space-grade modules or custom IoT applications, we ensure high yield, minimal weight, and superior optical performance.

Related Publications

Our innovations are backed by peer-reviewed research, including:
"AlGaAs/Si dual-junction tandem solar cells by epitaxial lift-off and print-transfer-assisted direct bonding", Energy Science & Engineering, 6, 47-55 (2018)
🔗 https://doi.org/10.1002/ese3.182
"Ultra-thin flexible GaAs photovoltaics in vertical forms printed on metal surfaces without interlayer adhesives", Appl. Phys. Lett. 108, 253101 (2016)
🔗 https://doi.org/10.1063/1.4954039

Performance Highlights

  • Ultra-Thin & Flexible Design: Ideal for curved or lightweight platforms
  • High Efficiency: Exceptional power conversion across a broad spectrum
  • Adhesive-Free Metal Bonding: Enables direct mounting and thermal stability
  • Lift-Off & Wafer Reuse Capability: Sustainable and cost-effective production


Key Specifications for GaAs PV Development

  • Wafer Type: GaAs or AlGaAs-based heterostructures
  • Structure: Single or multi-junction epitaxial stacks
  • Flexibility: Thickness-tuned for bending or vertical mounting
  • Spectral Range: Optimized for 300–900 nm
  • Layer Uniformity: < ±3% across 2” wafer
  • Lift-Off Capability: Epitaxial lift-off and print-transfer enabled
  • Growth Method: MOCVD or MBE (on request)