Research-grade epitaxial wafers


InGaAs Avalanche Photodiode (APD)

2024.12.10 | EPI Solution


Our In₀.₅₃Ga₀.₄₇As avalanche photodiode (APD) epitaxial wafers are engineered for high-performance photon detection in the near-infrared (NIR) spectrum (900–1700 nm). These wafers are lattice-matched to InP substrates and grown via Metal-Organic Chemical Vapor Deposition (MOCVD), offering excellent uniformity, low dark current, and internal gain for enhanced signal detection.


Superior NIR Detection with Internal Gain

InGaAs APDs extend the sensitivity of traditional photodiodes by incorporating avalanche multiplication, enabling detection of extremely weak optical signals. The internal gain mechanism amplifies the photocurrent, improving signal-to-noise performance and making them ideal for time-of-flight measurements, quantum communication, and long-range optical sensing.

SAM Structure for Enhanced Performance

EpiSolution’s InGaAs APDs adopt the Separate Absorption and Multiplication (SAM) structure, integrating a carefully engineered grading layer between the absorption (InGaAs) and multiplication (InP) regions. This grading layer mitigates hole accumulation at the valence band barrier—an issue commonly observed in conventional SAM structures—by smoothing the bandgap transition. As a result, carrier transport is significantly improved, avalanche gain is enhanced, and excess noise is reduced, enabling high responsivity and stable operation even under high bias conditions.

Precision Epitaxy and Process Control

Our APD wafers are fabricated using advanced MOCVD growth techniques with sub-5% layer thickness variation and interface roughness under 5 Å RMS (verified via TEM/AFM). We offer process compatibility with passivation, Zn-diffusion for junction formation, and lift-off techniques, ensuring reliable device prototyping and manufacturing.

Performance Highlights

  • High Internal Gain: Avalanche multiplication enables detection of weak signals
  • Low Noise: SAM structure minimizes excess noise factor
  • Fast Response: Suitable for GHz-level applications including LIDAR and QKD
  • Thermal Stability: Reliable performance across wide temperature ranges
  • Flexible Design Support: Customizable absorption/multiplication layers for specific application needs


Key Specifications for InGaAs APD Development

  • Wafer Size: 2", 3", or 4"
  • Material: In₀.₅₃Ga₀.₄₇As on InP substrate
  • Structure: SAM (Separate Absorption and Multiplication)
  • Intrinsic Absorption Layer: 1.5–2.5 µm thick (customizable)
  • Multiplication Layer: Undoped InP
  • Background Doping: < 8×10¹⁴ cm⁻³
  • Carrier Mobility: > 8,500 cm²/Vs
  • Dark Current: < 1 nA
  • Breakdown Voltage: Typically 30–60 V
  • Avalanche Gain: Up to ×150 (depending on bias and structure)
  • Lattice Mismatch: < 0.1%